Top Cool Package for Power Discrete MOSFETS AND90190/D
Top Cool Layout Benefits
Although traditional power SMDs yield small solutions, they have the need for the back of the board to remain unpopulated underneath them. This is for heatsinking reasons. Thus, some board space is unavailable and nets a larger overall board size. Top cool devices bypass this issue because the heatsinking occurs through the top of the device. This allows for board population underneath the MOSFETs.
This space can be utilized for but not limited to, components such as:
This in turn can yield smaller board sizes, reduced path lengths for gate drive signals, and more desirable solution size.
Gate drive circuitry
Supporting components (capacitors, snubbers, etc)
Cooling has always been a challenge when it comes to power design. onsemi offers the new top cooling MOSFETs to address this issue by changing the heatsink to the top of the device. This allows heat to be dissipated directly into a heatsink while heat propagation is mainly through printed circuit board with typical surface mount devices. The top cool package also reduces the size of PCB and improves thermal performance. This application note discusses all of the benefits of implementing top cool MOSFETs in your system.